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    制程能力参数/ Process Capability Parameters
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产品类别Product category 柔性线路板、软硬结合板Soft combined with flexible PCB board
月产量Monthly output 5000万平方米,An area of 5000 square meters.
材料Material 聚酰亚胺、聚脂、PET、PT、压延、电解、CAD资料(POWERPCB,PROTEL,PADS2000,AUTOCAD,ORCAD等)
阻焊Solder resist 层压覆盖膜、液态感光防焊油墨、PI油膜。Laminated indusium、Liquid photosensitive prevent weld ink、PI oil film
表面处理Surface treatment 喷锡、镀锡、沉锡、镀金、化学沉金、防氧化(OSP)、沉铜、镀锡铜 Hot Air Solder Leveling、Tinning、Sink tin、gold-plating、Chemistry sink gold、Anti-oxidation、Sink copper、Tin copper
成品厚度Finished Thickness 0.068-0.6mm
布线层数Circuit Layers 单面/多层(4-12层)  Single-sided/multi-layer(4-2 Layer)
最细导线/间距Most thin wire/spacing 2-3mil
最小孔径Min Hole Diameter 0.2mm
最大板厚/孔径比 Maximum thickness/aperture ratio ≤5Max Outline
最大加工尺寸Max Outline 500×350mm
外形加工Profiling Process 数控铣边、冲模、精度﹢0.1mm CNC punching accuracy 0.1 mm edge
验收标准Acceptance standard 客标、IPC、国标Guest standard IPC gb
样板交付周期Sample delivery cycle 3-5日3-5Day